H01H 2050/049
Assembling or mounting multiple relays in one common housing
Official title: {Assembling or mounting multiple relays in one common housing}
H01H2050/049 (Assembling or mounting multiple relays in one common housing) appears on 73 US grants and 63 published applications in this corpus.
Search patents in H01H- Granted patents
- 73
- Published applications
- 63
- Assignees
- 49
- Inventors
- 153
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 2 |
| 2003 | 3 | 2 |
| 2004 | 5 | 2 |
| 2005 | 1 | 3 |
| 2006 | 1 | 3 |
| 2007 | 1 | 2 |
| 2008 | 1 | 1 |
| 2009 | 1 | 1 |
| 2010 | 3 | 2 |
| 2011 | 1 | 5 |
| 2012 | 5 | 2 |
| 2013 | 2 | 2 |
| 2014 | 4 | 2 |
| 2015 | 1 | 5 |
| 2016 | 6 | 5 |
| 2017 | 2 | 1 |
| 2018 | 3 | 1 |
| 2019 | 1 | 2 |
| 2020 | 2 | 6 |
| 2021 | 3 | 0 |
| 2022 | 2 | 5 |
| 2023 | 2 | 2 |
| 2024 | 4 | 1 |
| 2025 | 0 | 1 |
| 2026 | 2 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Relay28 Apr 2026US 12,614,687 B2BYD Company Limited
- Relay base10 Mar 2026US 12,573,571 B2Hitachi Energy Ltd
- Circuit structure3 Sep 2024US 12,082,375 B2Autonetworks Technologies, Ltd.
- Relay, apparatus including relay, and load testing apparatus including relay2 Jul 2024US 12,027,331 B2Tatsumi Ryoki Co., Ltd
- Electrical junction box2 Jul 2024US 12,027,799 B2Yazaki Corporation
- High current relay module and electrical system30 Jul 2026US 2026/0221361 A1Lear Corporation
- High voltage relay for electric vehicle30 Jul 2026US 2026/0221632 A1Fca US LLC
- Onboard electrical device16 Jul 2026US 2026/0200326 A1Toyota Jidosha Kabushiki Kaisha
- Battery disconnect device23 Apr 2026US 2026/0112797 A1Samsung SDI.Co., Ltd.
- Electric Junction Box12 Mar 2026US 2026/0074132 A1Yazaki Corporation
Most cited
By later US patents
- Electronic component51US 9,320,162 B2Yazaki Corporation · 2016
- Multi integrated switching device structures35US 8,957,747 B2Telepath Networks, Inc. · 2015
- Single pole, single current path switching system and method31US 10,361,051 B2Rockwell Automation Technologies, Inc. · 2019
- Printed circuit board19US 6,049,043 ASiemens Aktiengesellschaft · 2000
- Electromagnetic reply19US 6,337,614 B12002