Circuit structure
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorsYuki Fujimura, Hitoshi Takeda
Life of this patent
Estimating the term…
Abstract
Provided is a circuit structure with a new structure that can improve a heat dissipation efficiency of a heat generating component while having resistance to a reaction force of a thermally conductive member. Provided is a circuit structure including: a heat generating component; bus bars that are connected to connection portions of the heat-generating component; cases that accommodate the heat-generating component and the bus bars; an elastic thermally conductive member that comes into thermal contact with the bus bars; a pressing portion that is provided on the cases and brings the bus bars into contact with the thermally conductive member; and a reinforcing wall portion that protrudes outside of the cases and reinforces the pressing portion.
Claims5
A circuit structure comprising:
- a heat generating component;
- a bus bar connected to a connection portion of the heat generating component;
- a case for accommodating the heat generating component and the bus bar;
- an elastic thermally conductive member that is configured to come into thermal contact with the bus bar, wherein,
- with respect to an upward direction of the case, the elastic thermally conductive member is positioned below both the heat generating component and the bus bar;
- a pressing portion that is provided on the case and causes the bus bar to come into contact with the thermally conductive member;
- and
- a reinforcing wall portion that protrudes outside of the case and reinforces the pressing portion.
Dependencies are inferred from the claim text.