H01G 4/1281
With grain boundary layer
Official title: {with grain boundary layer}
H01G4/1281 (With grain boundary layer) appears on 81 US grants and 58 published applications in this corpus.
Search patents in H01G- Granted patents
- 81
- Published applications
- 58
- Assignees
- 27
- Inventors
- 226
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 14 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 2 |
| 2009 | 1 | 1 |
| 2010 | 1 | 0 |
| 2011 | 1 | 1 |
| 2012 | 1 | 3 |
| 2013 | 2 | 2 |
| 2014 | 2 | 1 |
| 2015 | 0 | 2 |
| 2016 | 1 | 3 |
| 2017 | 4 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 5 |
| 2020 | 3 | 6 |
| 2021 | 4 | 2 |
| 2022 | 3 | 7 |
| 2023 | 5 | 2 |
| 2024 | 1 | 4 |
| 2025 | 2 | 3 |
| 2026 | 5 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer electronic component with controlled Sn diffusion in internal electrode28 Apr 2026US 12,614,668 B2Samsung Electro-Mechanics Co., Ltd.
- Dielectric composition, electronic device, and multilayer electronic device10 Mar 2026US 12,573,554 B2TDK Corporation
- Ceramic dielectrics with high permittivity and low dielectric loss and preparation method therefor24 Feb 2026US 12,559,426 B2Korea Advanced Institute of Science and Technology
- Dielectric composition, electronic device, and multilayer electronic device24 Feb 2026US 12,562,311 B2TDK Corporation
- Multilayer electronic component3 Feb 2026US 12,542,238 B2Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component30 Jul 2026US 2026/0221340 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer ceramic electronic device and dielectric ceramic composition30 Jul 2026US 2026/0221342 A1Taiyo Yuden Co., Ltd.
- Multilayer electronic component23 Jul 2026US 2026/0213072 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component23 Jul 2026US 2026/0213073 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component23 Jul 2026US 2026/0213076 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Ceramic multilayer chip capacitor and method for making34US 5,097,391 ATDK Corporation · 1992
- Intergranular insulation type polycrystalline ceramic semiconductive composition31US 3,933,668 ASony Corporation · 1976
- Doped titanate glass-ceramic for grain boundary barrier layer capacitors31US 4,870,539 AInternational Business Machines Corporation · 1989
- Method for producing boundary layer semiconductor ceramic capacitors29US 4,380,559 AMurata Manufacturing Co., Ltd. · 1983
- Grain boundary barrier layer ceramic dielectrics and the method of manufacturing capacitors therefrom20US 4,309,295 AU. S. Philips Corporation · 1982