Multilayer electronic component

A multilayer electronic component comprising:

• a body including a capacitance formation portion including a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a thickness direction and a cover portion disposed above and below the capacitance formation portion in the thickness direction;
• and
• an external electrode disposed on the body,
• wherein the cover portion includes an inner cover portion adjacent to the capacitance formation portion and an outer cover portion adjacent to an outer surface of the cover portion, and
• when an average value of a major axis length and a minor axis length of a grain is defined as grain size, the outer cover portion includes a region in which a standard deviation of the grain size is twice or more that of the inner cover portion.

A multilayer electronic component, comprising:

• a capacitance forming portion comprising first and second internal electrodes stacked in a thickness direction with a dielectric layer interposed therebetween;
• and
• top and bottom cover portions, disposed above and below the capacitance forming portion in the thickness direction, each of the top and bottom cover portions comprising:
• an inner cover portion disposed to be in contact with the capacitance forming portion and including first dielectric grains having a first average grain size, and
• an outer cover portion disposed on the inner cover portion and away from the capacitance forming portion in the thickness direction, and including the first dielectric grains and second dielectric grains having a second average grain size,
• wherein a ratio of first average grain size to second average grain size is greater than 2.0,
• wherein a ratio of an average thickness of the outer cover portion to an average thickness of the cover portion is 50% or more and 80% or less, and
• a number of moles of Dy included in the cover portion, based on 100 moles of Ti, is 3.7 to 4.5.