H01C 17/06593
Characterised by the temporary binder
Official title: {characterised by the temporary binder}
H01C17/06593 (Characterised by the temporary binder) appears on 22 US grants and 16 published applications in this corpus.
Search patents in H01C- Granted patents
- 22
- Published applications
- 16
- Assignees
- 23
- Inventors
- 70
- Latest grant
- 2 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 2 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 3 |
| 2016 | 2 | 0 |
| 2017 | 1 | 1 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 1 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 2 |
| 2023 | 0 | 1 |
| 2024 | 1 | 1 |
| 2025 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Polyvinyl acetal resin2 Dec 2025US 12,486,347 B2Sekisui Chemical Co., Ltd.
- Thermistor paste and manufacturing method thereof20 May 2025US 12,308,147 B2Yageo Corporation
- Three-dimensional printing25 Jun 2024US 12,017,406 B2Hewlett-Packard Development Company, L. P.
- Production method for an electrical resistance element and corresponding resistance element28 Jun 2022US 11,373,787 B2Isabellenhuette Heusler GmbH & Co. KG
- Resistor, circuit board, and electronic device16 Feb 2021US 10,923,252 B2KYOCERA Corporation
- Thermistor paste and manufacturing method thereof13 Feb 2025US 2025/0054662 A1Yageo Corporation
- Three-dimensional printing24 Oct 2024US 2024/0351274 A1Hewlett-Packard Development Company, L. P.
- Polyvinyl acetal resin5 Jan 2023US 2023/0002286 A1Sekisui Chemical Co., Ltd.
- Method for producing a layer structure using a paste on the basis ofa resistive alloy17 Feb 2022US 2022/0051834 A1Isabellenhütte Heusler GmbH & Co. KG
- Three-dimensional printing10 Feb 2022US 2022/0040918 A1Hewlett-Packard Development Company, L. P.
Most cited
By later US patents
- Printing paste and method of applying said paste21US 5,009,708 ARobert Bosch GmbH · 1991
- (Oxide or sulfide) powder epoxy (meth) acrylate w/glass and/or metal18US 5,973,034 ANippon Kayaku Kabushiki Kaisha · 1999
- Thick film resistor composition17US 4,695,504 AMatsushita Electric Industrial Co., Ltd. · 1987
- Green ceramic of lead-free glass, conductive carbon, silicone resin and AlPO.sub.4, useful, after firing, as an electrical resistor13US 4,433,092 AChampion Spark Plug Company · 1984
- Method of applying a polymer thick-film resistive paste for making polymer thick-film resistor having improved tolerances10US 7,575,778 B2Embed Technology Co., Ltd. · 2009