(Oxide or sulfide) powder epoxy (meth) acrylate w/glass and/or metal

A resin composition for the production of resistors, phosphors, ribs or conductor circuits which comprises (A) an unsaturated group-containing resin which is an epoxy (meth)acrylate resulting from the reaction of (a) a copolymerization epoxy resin derived from the copolymerization of one or more epoxy monomers and one or more monofunctional ethylenically unsaturated group-containing compounds other than the epoxy monomers having at least two epoxy groups in its molecule with (b) a compound having one unsaturated double bond and one carboxyl group in one molecule and (c) a saturated monocarboxylic acid as an optional component, the reaction product epoxy(meth)acrylate being allowed to react with (d) optionally, a polybasic acid anhydride, (B) a diluent, (C) a photopolymerization initiator, (D) glass powder or glass beads, and (E) optionally one or more substances selected from the group consisting of metal powders, metal oxides and metal sulfides, which (D) and (E) optionally has an ethylenically unsaturated bond on their surfaces, and is characterized in that the residual organic matter of said resin composition in patterns of resistors, phosphors, ribs or conductor circuits which are formed by developing the unexposed portions obtained by exposing the resin composition or a film thereof to ultraviolet rays through a pattern-formed film and then baking at a temperature of 400 to 1,000.degree. C. are 0.3% by weight or lower.