H01C 17/06566
Composed of borides
Official title: {composed of borides (H01C17/0652 takes precedence)}
H01C17/06566 (Composed of borides) appears on 26 US grants and 12 published applications in this corpus.
Search patents in H01C- Granted patents
- 26
- Published applications
- 12
- Assignees
- 14
- Inventors
- 53
- Latest grant
- 19 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 3 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 1 |
| 2019 | 0 | 2 |
| 2020 | 1 | 0 |
| 2021 | 2 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 1 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Over-current protection device19 Aug 2025US 12,394,545 B2Polytronics Technology Corp.
- PPTC material with low percolation threshold for conductive filler19 Sep 2023US 11,763,968 B2Littelfuse, Inc.
- Composite electronic component, composite electronic component package, circuit board, and method of producing a composite electronic component27 Apr 2021US 10,991,513 B2Taiyo Yuden Co., Ltd.
- Resistor, circuit board, and electronic device16 Feb 2021US 10,923,252 B2KYOCERA Corporation
- PPTC material with low percolation threshold for conductive filler29 Dec 2020US 10,878,980 B2Littelfuse, Inc.
- Over-current protection device18 Apr 2024US 2024/0127988 A1Polytronics Technology Corp.
- Pptc material with low percolation threshold for conductive filler18 Mar 2021US 2021/0082603 A1Littelfuse, Inc.
- Resistor, circuit board, and electronic device12 Sep 2019US 2019/0279793 A1KYOCERA Corporation
- Pptc material with low percolation threshold for conductive filler14 Mar 2019US 2019/0080824 A1Littelfuse, Inc.
- Composite electronic component, composite electronic component package, circuit board, and method of producing a composite electronic component6 Dec 2018US 2018/0350525 A1Taiyo Yuden Co., Ltd.
Most cited
By later US patents
- Temperature coefficient of resistance modifiers for thick film resistors22US 4,225,468 AE. I. Du Pont de Nemours and Company · 1980
- Screen-printing ink8US 4,420,338 AU. S. Philips Corporation · 1983
- Glaze resistor8US 4,985,377 AMatsushita Electric Industrial Co., Ltd. · 1991
- Hexaboride resistor composition7US 4,512,917 AE. I. Du Pont de Nemours and Company · 1985
- Resistive paste and resistor material therefor7US 5,036,027 AMurata Manufacturing Co., Ltd. · 1991