Composite electronic component, composite electronic component package, circuit board, and method of producing a composite electronic component

A composite electronic component package, comprising:

• a composite electronic component including
• a first electronic component including
• a ceramic body having
• a first main surface and a second main surface that face each other,
• a first end surface and a second end surface that are orthogonal to the first main surface and the second main surface,
• a first side surface and a second side surface that are orthogonal to the first main surface, the second main surface, the first end surface, and the second end surface, and
• a first external electrode and a second external electrode that are respectively provided to the first end surface and the second end surface and respectively extend from the first end surface and the second end surface to the first main surface, and a second electronic component including
• a functional film that is provided to the first main surface, and
• a first electrode film and a second electrode film that are provided to both end portions of the functional film and that are provided physically spaced apart from the first external electrode and the second external electrode, the second electronic component being configured to fit within a thickness of each of the first external electrode and the second external electrode from the first main surface;
• a housing portion that includes a plurality of recesses, each of the plurality of recesses including a take-out opening and housing the composite electronic component with the second main surface facing toward the take-out opening;
• and
• a sealing portion that covers the take-out opening of each of the plurality of recesses,
• wherein the first electrode film and the second electrode film are provided to the first main surface and are omitted from the first side surface, the second side surface, and the second main surface.

A circuit board, comprising:

• a mount surface;
• a pair of first wiring lines and a pair of second wiring lines that are provided on the mount surface;
• and
• a composite electronic component that is mounted on the mount surface, the composite electronic component including
• a first electronic component including
• a ceramic body having
• a first main surface and a second main surface that face each other, the first main surface facing the mount surface,
• a first end surface and a second end surface that are orthogonal to the first main surface and the second main surface,
• a first side surface and a second side surface that are orthogonal to the first main surface, the second main surface, the first end surface, and the second end surface, and
• a first external electrode and a second external electrode that are respectively provided to the first end surface and the second end surface and respectively extend from the first end surface and the second end surface to the first main surface, and a second electronic component including
• a functional film that is provided to the first main surface, and
• a first electrode film and a second electrode film that are provided to both end portions of the functional film and that are provided physically spaced apart from the first external electrode and the second external electrode, the second electronic component being configured to fit within a thickness of each of the first external electrode and the second external electrode from the first main surface,
• wherein the first electrode film and the second electrode film are provided to the first main surface and are omitted from the first side surface, the second side surface, and the second main surface.