H01B 13/2653
Details of the soldering stage
Official title: {Details of the soldering stage}
H01B13/2653 (Details of the soldering stage) appears on 3 US grants and 3 published applications in this corpus.
Search patents in H01B- Granted patents
- 3
- Published applications
- 3
- Assignees
- 3
- Inventors
- 5
- Latest grant
- 18 Feb 2025
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| 2021 | 0 | 1 |
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| 2023 | 1 | 1 |
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| 2025 | 1 | 0 |
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Recent patents
- Stranded cable subunits with a central member for a bundled cable18 Feb 2025US 12,230,420 B2Corning Research & Development Corporation
- Methods for bonding stranded cable subunits to central member17 Oct 2023US 11,791,067 B2Corning Research & Development Corporation
- Systems and methods for applying metallic laminates to cables27 Jun 2017US 9,691,524 B2NKT HV Cables AB
- Methods for bonding stranded cable subunits to central member28 Dec 2023US 2023/0420162 A1Corning Research & Development Corporation
- Methods for bonding stranded cable subunits to central member4 Mar 2021US 2021/0065936 A1Corning Research & Development Corporation
- Systems and methods for applying metallic laminates to cables9 Jun 2016US 2016/0163418 A1ABB Technology AG
Most cited
By later US patents