G05D 23/306
Using semiconductor devices
Official title: {using semiconductor devices}
G05D23/306 (Using semiconductor devices) appears on 12 US grants and 12 published applications in this corpus.
Search patents in G05D- Granted patents
- 12
- Published applications
- 12
- Assignees
- 9
- Inventors
- 17
- Latest grant
- 31 May 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 2 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 4 |
| 2018 | 1 | 1 |
| 2019 | 2 | 1 |
| 2020 | 2 | 2 |
| 2021 | 0 | 1 |
| 2022 | 3 | 0 |
By publication year.
Recent patents
- Water-cooling thermal dissipating method31 May 2022US 11,348,860 B2Enermax Technology Corporation
- Electronic temperature switch8 Mar 2022US 11,271,386 B2Hydra-Electric Company
- Electronic temperature switch1 Feb 2022US 11,239,651 B2Hydra-Electric Company
- Electronic temperature switch23 Jun 2020US 10,693,290 B2Hydra-Electric Company
- Water-cooling thermal dissipating system and thermal dissipating method26 May 2020US 10,665,528 B2Enermax Technology Corporation
- Electronic temperature switch22 Apr 2021US 2021/0119439 A1Hydra-Electric Company
- Electronic temperature switch29 Oct 2020US 2020/0343714 A1Hydra-Electric Company
- Water-cooling thermal dissipating method30 Jul 2020US 2020/0243421 A1Enermax Technology Corporation
- Water-cooling thermal dissipating system and thermal dissipatiing method12 Sep 2019US 2019/0279918 A1Enermax Technology Corporation
- Electronic temperature switch7 Jun 2018US 2018/0159311 A1Hydra-Electric Company
Most cited
By later US patents
- Optical transmitting module and a method for controlling the same35US 7,269,192 B2Sumitomo Electric Industries, Ltd. · 2007
- Hand held appliance28US 10,085,538 B2Dyson Technology Limited · 2018
- Method and apparatus for temperature control of heater18US 6,627,859 B1Tokyo Electron Limited · 2003
- Method and apparatus for temperature control15US 6,525,550 B2Bookham Technology PLC · 2003
- Hybrid system and method for determining performance levels based on thermal conditions within a processor4US 9,671,767 B2Advanced Micro Devices, Inc. · 2017