G05B 2219/50007
Multiple polishing heads, oscillating and rotating
G05B2219/50007 (Multiple polishing heads, oscillating and rotating) appears on 6 US grants and 3 published applications in this corpus.
Search patents in G05B- Granted patents
- 6
- Published applications
- 3
- Assignees
- 3
- Inventors
- 14
- Latest grant
- 4 Jul 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 1 | 1 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
| 2023 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Ethercat liquid flow controller communication for substrate processing systems4 Jul 2023US 11,693,435 B2APPLIED Materials.Inc.
- Numerical control device and machine tool4 Jan 2022US 11,215,969 B2Fanuc Corporation
- Numerical controller oscillating motion adjustment4 Feb 2020US 10,551,816 B2Fanuc Corporation
- Wafer polishing method and apparatus12 Mar 1996US 5,498,196 ASpeedfam Corporation
- Wafer polishing method and apparatus12 Mar 1996US 5,498,199 ASpeedfam Corporation
Most cited
By later US patents
- Wafer polishing method and apparatus209US 5,329,732 ASpeedfam Corporation · 1994
- Wafer polishing method and apparatus157US 5,498,199 ASpeedfam Corporation · 1996
- Wafer polishing method and apparatus64US 5,498,196 ASpeedfam Corporation · 1996
- Ethercat liquid flow controller communication for substrate processing systems1US 11,693,435 B2APPLIED Materials.Inc. · 2023