G05B 2219/37602
Material removal rate
G05B2219/37602 (Material removal rate) appears on 22 US grants and 14 published applications in this corpus.
Search patents in G05B- Granted patents
- 22
- Published applications
- 14
- Assignees
- 9
- Inventors
- 13
- Latest grant
- 5 Mar 2013
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 3 |
| 2002 | 5 | 4 |
| 2003 | 1 | 1 |
| 2004 | 1 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 3 |
By publication year. Applications have been published since 2001.
Recent patents
- Processing method for a workpiece5 Mar 2013US 8,392,015 B2Canon Kabushiki Kaisha
- Method for processing surface and apparatus for processing same3 May 2005US 6,889,112 B2Ricoh Company, Ltd.
- System for real-time control of semiconductor wafer polishing25 May 2004US 6,739,944 B2Micron Technology, Inc.
- Automated system for repairing components12 Aug 2003US 6,606,541 B2United Technologies Corporation
- System for real-time control of semiconductor wafer polishing3 Dec 2002US 6,488,566 B2Micron Technology, Inc.
- Numerical control device22 May 2025US 2025/0164969 A1Fanuc Corporation
- Numerical control device20 Mar 2025US 2025/0093837 A1Fanuc Corporation
- Method for operating a machine tool2 Jan 2025US 2025/0004442 A1P & L GmbH & Co. KG
- Methods and systems for adapting a feed rate of a feed control on numerically controlled machine tools20 Jun 2024US 2024/0201664 A1Siemens Aktiengesellschaft
- Method for providing an edge preparation on a cutting edge of a tool and a control and a processing machine for carrying out the method20 Sep 2012US 2012/0238184 A1
Most cited
By later US patents
- System and method for real-time control of semiconductor a wafer polishing, and a polishing head316US 5,486,129 AMicron Technology, Inc. · 1996
- System for real-time control of semiconductor wafer polishing including optical monitoring282US 5,658,183 AMicron Technology, Inc. · 1997
- System for real-time control of semiconductor wafer polishing including optical montoring249US 5,730,642 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing186US 5,851,135 AMicron Technology, Inc. · 1998
- System for real-time control of semiconductor wafer polishing160US 5,700,180 AMicron Technology, Inc. · 1997