System for real-time control of semiconductor wafer polishing
AssigneeMicron Technology, Inc.
InventorsGurtej S. Sandhu, Trung Tri Doan
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Abstract
A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and a controller selectively adjusting one of a plurality of adjustable polishing parameters during polishing of the wafer.
Claims27
A process for polishing a wafer comprising acts of:
- sensing an aspect of wafer polishing during wafer polishing;
- and
- selectively isolating and changing polishing rates of specific regions of the wafer in response to said sensing during polishing while globally polishing the entire wafer.
A process for planarizing a wafer comprising acts of:
- sensing an aspect of wafer polishing during wafer planarizing;
- and
- selectively isolating and changing the planarizing rates of specific regions of the wafer in response to said sensing during planarizing while globally planarizing the entire wafer.
A process for planarizing a wafer comprising acts of:
- sensing an aspect of wafer polishing during wafer polishing;
- and
- selectively isolating and changing the polishing rates of specific regions of the wafer in response to said sensing during polishing while globally polishing the entire wafer;
- and
- after the polishing, singulating the wafer to provide individual integrated circuits.
Dependencies are inferred from the claim text.