G05B 2219/33225
Interface nc machine to data server
G05B2219/33225 (Interface nc machine to data server) appears on 5 US grants and 10 published applications in this corpus.
Search patents in G05B- Granted patents
- 5
- Published applications
- 10
- Assignees
- 8
- Inventors
- 18
- Latest grant
- 12 Dec 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 0 | 1 |
| 2005 | 0 | 2 |
| 2006 | 1 | 1 |
| 2007 | 1 | 2 |
| 2008 | 0 | 1 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Information-linkage supporting apparatus and information-linkage supporting program12 Dec 2017US 9,841,754 B2Mitsubishi Electric Corporation
- Method for operation of an automation device and apparatus for carrying out the method3 Feb 2015US 8,948,902 B2Siemens Aktiengesellschaft
- Molding machine and molding machine management system24 Feb 2009US 7,496,427 B2Sumitomo Heavy Industries, Ltd.
- Control device capable of data communication and transmission system provided therewith14 Aug 2007US 7,257,578 B2Mori Seiki Co., Ltd.
- Method and apparatus for the monitoring and control of a semiconductor manufacturing process17 Oct 2006US 7,123,980 B2Tokyo Electron Limited
- Information processing device and non-transitory computer-readable recording medium20 Aug 2026US 2026/0241569 A1KYOCERA Corporation
- Information-linkage supporting apparatus and information-linkage supporting program31 Mar 2016US 2016/0091890 A1Mitsubishi Electric Corporation
- Method for Operation of an Automation Device and Apparatus for Carrying Out the Method6 Nov 2008US 2008/0275589 A1Siemens Aktiengesellschaft
- Simulation apparatus12 Apr 2007US 2007/0083285 A1Fanuc Corporation
- Molding machine and molding machine management system11 Jan 2007US 2007/0009627 A1Sumitomo Heavy Industries, Ltd.
Most cited
By later US patents
- Method and apparatus for the monitoring and control of a semiconductor manufacturing process49US 7,123,980 B2Tokyo Electron Limited · 2006
- Molding machine and molding machine management system4US 7,496,427 B2Sumitomo Heavy Industries, Ltd. · 2009
- Control device capable of data communication and transmission system provided therewith1US 7,257,578 B2Mori Seiki Co., Ltd. · 2007
- Method for operation of an automation device and apparatus for carrying out the method1US 8,948,902 B2Siemens Aktiengesellschaft · 2015