F28F 2275/061
By diffusion bonding
Official title: by diffusion bonding
F28F2275/061 (By diffusion bonding) appears on 48 US grants and 76 published applications in this corpus.
Search patents in F28F- Granted patents
- 48
- Published applications
- 76
- Assignees
- 54
- Inventors
- 172
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 3 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 2 |
| 2012 | 2 | 1 |
| 2013 | 2 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 6 |
| 2016 | 2 | 3 |
| 2017 | 0 | 5 |
| 2018 | 2 | 3 |
| 2019 | 6 | 5 |
| 2020 | 5 | 4 |
| 2021 | 3 | 7 |
| 2022 | 1 | 9 |
| 2023 | 4 | 7 |
| 2024 | 10 | 9 |
| 2025 | 5 | 4 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Printed-circuit-type heat exchanger having improved durability, hydrogen storage device comprising same, and hydrogen compression device9 Jul 2026US 2026/0194303 A1Energyn Inc.
- Temperature adjustment unit and manufacturing method of temperature adjustment unit7 May 2026US 2026/0124669 A1Toyota Jidosha Kabushiki Kaisha
- Three dimensional heat dissipation device, manufacturing method thereof, and shaping tool18 Sep 2025US 2025/0290704 A1Purple Cloud Development Pte. Ltd.
- Communication-type thermal conduction device11 Sep 2025US 2025/0283668 A1Purple Cloud Development Pte. Ltd.
Most cited
By later US patents
- Fluid processing device and method30US 6,994,829 B2Battelle Memorial Institute · 2006
- Single phase micro/mini channel heat exchangers for gas turbine intercooling19US 10,316,750 B2Rolls-Royce North American Technologies Inc. · 2019
- Evaporative compact high intensity cooler15US 8,056,615 B2Hamilton Sundstrand Corporation · 2011
- Heat exchanger10US 5,383,518 ARolls-Royce and Associates Limited · 1995
- Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment6US 8,096,348 B2Seiko Epson Corporation · 2012