F04C 29/047

Cooling of electronic devices installed inside the pump housing

Official title: {Cooling of electronic devices installed inside the pump housing, e.g. inverters}

F04C29/047 (Cooling of electronic devices installed inside the pump housing) appears on 76 US grants and 125 published applications in this corpus.

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Granted patents
76
Published applications
125
Assignees
52
Inventors
292
Latest grant
8 Sep 2026

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F04C 29/047: granted patents and published applications per publication year
YearGranted patentsPublished applications
199910
200000
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200311
200401
200502
200630
200700
200801
200902
201002
201106
201235
201335
201412
201515
201662
201757
201818
201956
2020511
202157
2022511
202345
2024119
20251017
202669

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.