C09J 2415/006
In the substrate
Official title: in the substrate
C09J2415/006 (In the substrate) appears on 4 US grants and 9 published applications in this corpus.
Search patents in C09J- Granted patents
- 4
- Published applications
- 9
- Assignees
- 6
- Inventors
- 22
- Latest grant
- 3 Oct 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 3 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 2 |
| 2023 | 1 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
By publication year.
Recent patents
- Method for adhesively bonding rubber-based thermoplastic substrates3 Oct 2023US 11,773,294 B2Sika Technology AG
- Pretreatment of substrates that have unsaturated units23 Apr 2019US 10,266,726 B2Sika Technology AG
- Laminates of partially scorched adhesive and DVA film28 Oct 2014US 8,871,125 B2ExxonMobil Chemical Patents Inc.
- Release liner for pressure sensitive adhesives3 Jan 2006US 6,982,107 B13M Innovative Properties Company
- Systems and methods for crack repair in recreational court surfaces7 Aug 2025US 2025/0250747 A1
- Adhesive tape15 Dec 2022US 2022/0396717 A1Denka Company Limited
- Method for adhesively bonding rubber-based thermoplastic substrates10 Mar 2022US 2022/0073688 A1Sika Technology AG
- Connecting of sealing strips10 Jan 2019US 2019/0010360 A1Sika Technology AG
- Pretreatment of substrates that have unsaturated units3 Nov 2016US 2016/0319161 A1Sika Technology AG
Most cited
By later US patents