C08G 59/145
Compounds containing one epoxy group
Official title: {Compounds containing one epoxy group}
C08G59/145 (Compounds containing one epoxy group) appears on 108 US grants and 27 published applications in this corpus.
Search patents in C08G- Granted patents
- 108
- Published applications
- 27
- Assignees
- 70
- Inventors
- 252
- Latest grant
- 30 Apr 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 2 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 9 | 0 |
| 1981 | 4 | 0 |
| 1982 | 6 | 0 |
| 1983 | 5 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 6 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 7 | 0 |
| 1990 | 6 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 6 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 2 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 2 |
| 2015 | 0 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 2 | 2 |
| 2020 | 2 | 5 |
| 2021 | 3 | 3 |
| 2022 | 0 | 0 |
| 2023 | 2 | 0 |
| 2024 | 3 | 4 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Process of manufacturing surfactants and lubricants30 Apr 2024US 11,970,574 B2Dow Global Technologies LLC
- Process of manufacturing polyols16 Apr 2024US 11,958,936 B2Dow Global Technologies LLC
- Process of manufacturing polyols27 Feb 2024US 11,912,822 B2Dow Global Technologies LLC
- Coating composition12 Dec 2023US 11,840,643 B2Axalta Coating Systems IP Co., LLC
- Encapsulating or filling composition for electronic devices and electronic apparatus6 Jun 2023US 11,667,786 B2Samsung Display Co., Ltd.
- Glycidyl ether group-containing compound, curable resin composition, cured product, and laminate5 Jun 2025US 2025/0179237 A1DIC Corporation
- Epoxy resin composition, liquid compression mold material, glob-top material, and semiconductor device7 Nov 2024US 2024/0368374 A1Namics Corporation
- Hardener for epoxy resins25 Jul 2024US 2024/0247096 A1Sika Technology AG
- Hydroxyl-functional thioether compounds and their use in curable compositions27 Jun 2024US 2024/0209140 A1BASF Coatings GmbH
- Novel compound, and curable resin composition containing said compound14 Mar 2024US 2024/0084065 A1Adeka Corporation
Most cited
By later US patents
- Hardenable resin compositions and methods88US 5,232,961 A1993
- Stable aqueous epoxy dispersions79US 4,315,044 ACelanese Corporation · 1982
- Photocopolymerizable compositons based on epoxy and polymer/hydroxyl-containing organic materials47US 4,593,051 AUnion Carbide Corporation · 1986
- Cationic epoxide resinous composition42US 4,182,831 ACelanese Polymer Specialties Company · 1980
- Polymerization initiator compositions40US 4,374,751 AGeneral Electric Company · 1983