Encapsulating or filling composition for electronic devices and electronic apparatus

An electronic apparatus comprising:

• a first substrate;
• an electronic device disposed on the first substrate;
• and
• one or more cured materials of an encapsulating or filling composition formed on the electronic device,
• wherein the encapsulating or filling composition comprises:
• a curable material comprising an epoxy group;
• a polymerization initiator;
• and
• a metal catalyst,
• wherein the metal catalyst is a metal-salen complex represented by Formula 3:
• wherein, in Formula 3,
• M1 is a metal atom,
• A1 and A2 are each independently a benzene group, a naphthalene group, a pyridine group, a thiophene group, or a pyrrole group,
• R31 to R34 are each independently selected from hydrogen, deuterium, —F, —Cl, —Br, —I, a hydroxyl group, a cyano group, a nitro group, an amidino group, a hydrazino group, a hydrazono group, a substituted or unsubstituted C1-C60 alkyl group, a substituted or unsubstituted C2-C60 alkenyl group, a substituted or unsubstituted C2-C60 alkynyl group, a substituted or unsubstituted C1-C60 alkoxy group, a substituted or unsubstituted C3-C60 cycloalkoxy group, a substituted or unsubstituted C3-C10 cycloalkyl group, a substituted or unsubstituted C1-C10 heterocycloalkyl group, a substituted or unsubstituted C3-C10 cycloalkenyl group, a substituted or unsubstituted C1-C10 heterocycloalkenyl group, a substituted or unsubstituted C6-C60 aryl group, a substituted or unsubstituted C6-C60 aryloxy group, a substituted or unsubstituted C6-C60 arylthio group, a substituted or unsubstituted C1-C60 heteroaryl group, a substituted or unsubstituted monovalent non-aromatic condensed polycyclic group, and a substituted or unsubstituted monovalent non-aromatic condensed heteropolycyclic group,
• R31 to R34 are optionally bound to form a substituted or unsubstituted ring,
• b31 and b32 are each independently an integer from 0 to 6,
• LQ1 is a monovalent ligand, and
• m1 is an integer from 0 to 2.