C04B 35/63468
Polyamides
Official title: {Polyamides}
C04B35/63468 (Polyamides) appears on 71 US grants and 85 published applications in this corpus.
Search patents in C04B- Granted patents
- 71
- Published applications
- 85
- Assignees
- 85
- Inventors
- 290
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 6 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 0 | 0 |
| 2004 | 2 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 3 |
| 2007 | 1 | 1 |
| 2008 | 1 | 2 |
| 2009 | 1 | 2 |
| 2010 | 0 | 3 |
| 2011 | 1 | 3 |
| 2012 | 1 | 6 |
| 2013 | 4 | 6 |
| 2014 | 1 | 7 |
| 2015 | 3 | 3 |
| 2016 | 4 | 2 |
| 2017 | 2 | 4 |
| 2018 | 0 | 6 |
| 2019 | 3 | 7 |
| 2020 | 0 | 3 |
| 2021 | 6 | 8 |
| 2022 | 3 | 5 |
| 2023 | 2 | 2 |
| 2024 | 2 | 1 |
| 2025 | 2 | 4 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Binder solutions comprising a fugitive metal precursor for use in additive manufacturing17 Feb 2026US 12,551,947 B2General Electric Company
- Compound particles for use in a shaping and sintering process and process for preparing compound particles20 Jan 2026US 12,528,117 B2Headmade Materials GmbH
- Method for layer-wise manufacturing of a shaped body30 Dec 2025US 12,509,400 B2IO Tech Group Ltd.
- Interface material formulations for additive fabrication18 Feb 2025US 12,227,461 B2Desktop Metal, Inc.
- Insulation sheet12 Nov 2024US 12,142,393 B2Teijin Limited
- Compound particles for use in a shaping and sintering process and process for preparing compound particles23 Apr 2026US 2026/0108942 A1Headmade Materials GmbH
- Binder solutions comprising a fugitive metal precursor for use in additive manufacturing26 Feb 2026US 2026/0055292 A1General Electric Company
- Electronic atomization device, and componets and preparation method and application thereof8 Jan 2026US 2026/0007166 A1Smoore International Holdings Limited
- Compound particles for use in a shaping and sintering process and process for preparing compound particles14 Aug 2025US 2025/0256328 A1Headmade Materials GmbH
- Binder component for a feedstock compound for use in a shaping and sintering process, particulate feedstock compound, and shaping and sintering process1 May 2025US 2025/0136814 A1Headmade Materials GmbH
Most cited
By later US patents
- Stereolithography resin for rapid prototyping of ceramics and metals126US 6,117,612 AThe Regents of the University of Michigan · 2000
- Method of optimizing composite preparation for electrical properties: maximum capacitance electrodes39US 5,096,663 AAuburn University · 1992
- Ceramic laminated circuit substrate33US 4,998,159 AHitachi, Ltd. · 1991
- Metal oxide resistor, power resistor, and power circuit breaker28US 5,509,558 AKabushiki Kaisha Toshiba · 1996
- Ceramic composition suited to be injection molded and sintered23US 4,207,226 AThe Carborundum Company · 1980