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US 4,998,159 AGranted
Ceramic laminated circuit substrate
AssigneeHitachi, Ltd.
InventorsHiroichi Shinohara, Hideo Suzuki, Satoru Ogihara, Hideo Arakawa
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AssigneeHitachi, Ltd.
InventorsHiroichi Shinohara, Hideo Suzuki, Satoru Ogihara, Hideo Arakawa
Estimating the term…
The present invention provides a ceramic laminated circuit substrate which is less in fluctuation of degree of shrinkage at firing and is less in voids and is suitable for formation of functional modules. This substrate comprises a conductor layer and a plurality of ceramic insulating layers wherein said ceramic insulating layers include at least one fiber-containing composite ceramic insulating layer. The present invention further provides a method for making this substrate which comprises preparing fiber-containing composite green sheets by adding to a green sheet raw material at least one of whiskers, glass filaments and chopped strands as fibers, laminating these fiber-containing composite green sheets in such direction that their casting directions are different together with green sheets containing no fibers to form a laminate and firing this laminate.
A ceramic laminated circuit substrate comprising conductor layers and a plurality of ceramic insulating layers, said conductor layers being disposed between said ceramic insulating layers, wherein said ceramic insulating layers include at least two fiber-containing composite ceramic insulating layers and at least one fiber-free ceramic insulating layer, and wherein said fiber-containing ceramic insulating layers are placed at a distance from each other by means of said fiber-free ceramic insulating layer and in such a manner that the fibers in said composite ceramic insulating layers are oriented at least bidirectionally (x and y direction);
A ceramic laminated circuit substrate comprising conductor layers and a plurality of ceramic insulating layers, said conductor layers being disposed between ceramic insulating layers, wherein said ceramic insulating layers include at least one fiber-containing composite ceramic insulating layer and at least one fiber-free ceramic insulating layer and the circuit substrate has a void content of 10 vol% or less.
A ceramic laminated circuit substrate comprising a pre-fired substrate, at least one fiber-free ceramic insulating layer formed on said pre-fired ceramic substrate, and carrying a conductor layer;
A ceramic laminated circuit substrate comprising conductor layers and ceramic insulating layers, said conductor layers being disposed between said ceramic insulating layers, wherein said ceramic insulating layers include two fiber-containing composite ceramic insulating layers and three fiber-free ceramic insulating layers, said fiber-containing composite ceramic insulating layers and said fiber-free ceramic insulating layers being alternately laminated in such a manner that the fibers in said composite ceramic insulating layers are oriented at least bidirectionally (x and y direction);
Dependencies are inferred from the claim text.