C04B 2237/61

Joining two substrates of which at least one is porous by infiltrating

Official title: Joining two substrates of which at least one is porous by infiltrating the porous substrate with a liquid, such as a molten metal, causing bonding of the two substrates, e.g. joining two porous carbon substrates by infiltrating with molten silicon

C04B2237/61 (Joining two substrates of which at least one is porous by infiltrating) appears on 207 US grants and 181 published applications in this corpus.

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207
Published applications
181
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107
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434
Latest grant
18 Aug 2026

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C04B 2237/61: granted patents and published applications per publication year
YearGranted patentsPublished applications
197620
197710
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197930
198030
198120
198220
198330
198450
198510
198600
198700
198820
198940
199050
199120
199240
199350
199450
199570
199640
199710
199800
199960
200040
200142
200288
200343
200483
200523
200630
200718
200814
200914
201022
201134
201204
2013215
201469
201567
2016716
201788
201867
20191312
2020108
202157
202297
202349
20241215
2025812
202634

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