B65H 55/046

Packages having a radial opening through which the material will pay off

Official title: {packages having a radial opening through which the material will pay off}

B65H55/046 (Packages having a radial opening through which the material will pay off) appears on 66 US grants and 39 published applications in this corpus.

Search patents in B65H
Granted patents
66
Published applications
39
Assignees
22
Inventors
66
Latest grant
8 Nov 2022

Filings by year

B65H 55/046: granted patents and published applications per publication year
YearGranted patentsPublished applications
197610
197730
197820
197910
198000
198110
198200
198320
198400
198510
198600
198700
198810
198920
199000
199110
199240
199300
199400
199510
199620
199700
199810
199920
200020
200100
200221
200302
200421
200501
200621
200722
200800
200900
201001
201112
201210
201313
201424
201533
201635
201772
201824
201951
202041
202111
202210
202300
202400
202502
202602

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.