B65H 55/00

Wound packages of filamentary material

B65H55/00 (Wound packages of filamentary material) appears on 362 US grants and 208 published applications in this corpus.

Search patents in B65H
Granted patents
362
Published applications
208
Assignees
212
Inventors
646
Latest grant
7 Jul 2026

Filings by year

B65H 55/00: granted patents and published applications per publication year
YearGranted patentsPublished applications
197640
197770
197850
197920
198050
198170
198270
198340
198460
1985150
198690
198760
198870
198990
1990130
1991120
1992150
1993170
199410
199520
1996110
199760
199880
199940
200060
200150
200278
2003819
20041313
2005116
200637
2007910
200838
200998
201065
2011411
201238
201349
201499
201578
2016711
2017148
2018513
20191212
202097
2021117
202242
202343
202425
202545
202616

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

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