B65D 75/34
And having several recesses to accommodate a series of articles or quantities
Official title: and having several recesses to accommodate a series of articles or quantities of material {(not used)}
B65D75/34 (And having several recesses to accommodate a series of articles or quantities) appears on 28 US grants and 24 published applications in this corpus.
Search patents in B65D- Granted patents
- 28
- Published applications
- 24
- Assignees
- 25
- Inventors
- 67
- Latest grant
- 14 Jun 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 2 |
| 2003 | 1 | 0 |
| 2004 | 1 | 3 |
| 2005 | 0 | 2 |
| 2006 | 2 | 2 |
| 2007 | 0 | 2 |
| 2008 | 1 | 1 |
| 2009 | 2 | 1 |
| 2010 | 2 | 2 |
| 2011 | 2 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 1 |
| 2015 | 1 | 0 |
| 2016 | 1 | 0 |
| 2017 | 0 | 3 |
| 2018 | 1 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Coating material, printing member for dot printing, and PTP packaging body14 Jun 2022US 11,358,406 B2Uacj Corporation
- Absorbing layer for blister package, laminate comprising same, and blister package using said laminate3 Jul 2018US 10,010,480 B2Kyodo Printing Co., Ltd.
- Method of fabricating a capsule belt12 Jan 2016US 9,233,786 B2Raindance Systems Pty Ltd.
- Multi-cavity container having offset indentures for dispensing fluids3 Nov 2015US 9,173,728 B2Merial Limited
- Packaging and delivery of pharmaceuticals and drugs5 Nov 2013US 8,573,202 B2Microdose Therapeutx, Inc.
- Cover tape and electronic component package31 Aug 2023US 2023/0272192 A1Denka Company Limited
- Cover tape and electronic component package24 Aug 2023US 2023/0265317 A1Denka Company Limited
- Coating material, printing member for dot printing, and ptp packaging body11 Apr 2019US 2019/0105936 A1Uacj Corporation
- Laminate for blister pack, blister pack using same, blister pack package, and method for manufacturing same30 Nov 2017US 2017/0341351 A1Kyodo Printing Co., Ltd.
- Absorbing layer for blister package, laminate comprising same, and blister package using said laminate9 Nov 2017US 2017/0319433 A1Kyodo Printing Co., Ltd.
Most cited
By later US patents
- Strip pack110US 6,375,956 B1Drugtech Corporation · 2002
- Peelable entry-resistant package64US 5,944,191 AFuisz Technologies Ltd. · 1999
- Tear-opening caplet blister foil package59US 5,088,603 ASharp Packaging, Inc. · 1992
- Method of making dual reuseable pouches59US 5,096,516 AZip-Pak Incorporated · 1992
- Blister pack opener-ejector44US 5,431,283 APrimary Delivery Systems, Inc. · 1995