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US 2023/0272192 A1Published application
Cover tape and electronic component package
AssigneeDenka Company Limited
InventorsKota SAWAGUCHI, Keisuke NABA, Gosuke NAKAJIMA
Life of this patent
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Abstract
This cover tape has at least a base layer and a heat seal layer, wherein the heat seal layer has a loss tangent tan δ of less than 1 in a temperature range of 150° C. or less in a dynamic viscoelastic measurement at a measurement frequency of 1 Hz.
Claims5
A cover tape comprising:
- at least a base layer, and a heat seal layer,
- wherein the heat seal layer has a loss tangent tan δ of less than 1 in a temperature range of 150° C. or less in a dynamic viscoelastic measurement at a measurement frequency of 1 Hz.
Dependencies are inferred from the claim text.