B32B 37/0023
Around holes, apertures or channels present in at least one layer
Official title: {around holes, apertures or channels present in at least one layer}
B32B37/0023 (Around holes, apertures or channels present in at least one layer) appears on 57 US grants and 42 published applications in this corpus.
Search patents in B32B- Granted patents
- 57
- Published applications
- 42
- Assignees
- 36
- Inventors
- 111
- Latest grant
- 17 Oct 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 7 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 2 |
| 2003 | 3 | 3 |
| 2004 | 1 | 2 |
| 2005 | 1 | 0 |
| 2006 | 1 | 1 |
| 2007 | 1 | 3 |
| 2008 | 0 | 1 |
| 2009 | 2 | 2 |
| 2010 | 2 | 3 |
| 2011 | 1 | 0 |
| 2012 | 4 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 3 |
| 2015 | 2 | 5 |
| 2016 | 1 | 1 |
| 2017 | 2 | 4 |
| 2018 | 2 | 1 |
| 2019 | 5 | 3 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 1 | 3 |
| 2023 | 1 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Apparatus for reducing fabric dimpling in electronic devices and associated methods17 Oct 2023US 11,787,164 B2Google Inc.
- Apparatus for reducing fabric dimpling in electronic devices and associated methods1 Mar 2022US 11,260,639 B2Google Inc.
- Protective material applicator device26 Oct 2021US 11,155,067 B2Superior Communications, Inc.
- Vehicle interior component and method of producing the same14 Jul 2020US 10,710,331 B2Toyota Boshoku Kabushiki Kaisha
- Protective material applicator device3 Sep 2019US 10,399,315 B2Superior Communications, Inc.
- Protective material applicator device12 Jun 2025US 2025/0187322 A1Superior Communications, Inc.
- Fabric with Conductive Core13 Feb 2025US 2025/0051978 A1SWNR Development, LLC
- Protective material applicator device19 Oct 2023US 2023/0330981 A1Superior Communications, Inc.
- Apparatus for reducing fabric dimpling in electronic devices and associated methods9 Jun 2022US 2022/0176685 A1Google Inc.
- Protective material applicator device14 Apr 2022US 2022/0111625 A1Superior Communications, Inc.
Most cited
By later US patents
- Methods of fabricating polymeric structures incorporating microscale fluidic elements375US 6,123,798 ACaliper Technologies Corp. · 2000
- Methods of fabricating polymeric structures incorporating microscale fluidic elements104US 7,138,032 B2Caliper Life Sciences, Inc. · 2006
- Damped laminates having welded through holes and/or edges with decreased spring back and improved fastener force retention and, a method of making57US 6,177,173 B13M Innovative Properties Company · 2001
- Process for forming open-centered multilayer ceramic substrates52US 5,478,420 AInternational Business Machines Corporation · 1995
- Protective material applicator device52US 9,010,396 B2Superior Communications, Inc. · 2015