B32B 2255/062
Metal layer being a foamed layer
Official title: metal layer being a foamed layer
B32B2255/062 (Metal layer being a foamed layer) appears on 21 US grants and 33 published applications in this corpus.
Search patents in B32B- Granted patents
- 21
- Published applications
- 33
- Assignees
- 21
- Inventors
- 66
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 1 |
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 2 |
| 2016 | 1 | 2 |
| 2017 | 0 | 6 |
| 2018 | 2 | 5 |
| 2019 | 2 | 1 |
| 2020 | 5 | 4 |
| 2021 | 2 | 1 |
| 2022 | 1 | 2 |
| 2023 | 2 | 4 |
| 2024 | 1 | 1 |
| 2025 | 1 | 1 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Asymmetry composite material21 Jul 2026US 12,686,199 B2LG Chem.Ltd.
- Display module and display device24 Feb 2026US 12,563,892 B2LG Display Co., Ltd.
- Electromagnetic interference shielding film and preparing methods thereof25 Feb 2025US 12,233,622 B2Asia Electronic Material Co., Ltd.
- Structural panels for exposed surfaces7 May 2024US 11,975,815 B2Lockheed Martin Corporation
- Resin coated metal sheet for container19 Sep 2023US 11,760,065 B2Jfe Steel Corporation
- Coil coating process27 Aug 2026US 2026/0249591 A1Lamcoatings B.V.
- Electromagnetic interference shielding film and preparing methods thereof15 May 2025US 2025/0153461 A1Asia Electronic Material Co., Ltd.
- Barrier laminate, lid material, and packaging container17 Oct 2024US 2024/0343458 A1Dai Nippon Printing Co.Ltd.
- Asymmetry composite material19 Oct 2023US 2023/0330975 A1LG Chem.Ltd.
- Liquid crystal polymer film, polymer film, and laminate12 Oct 2023US 2023/0321958 A1FUJIFILM Corporation
Most cited
By later US patents
- Constrained microlayer cellular material with high stiffness and damping4US 9,217,084 B2HRL Laboratories, LLC · 2015
- High conductivity graphene-metal composite and methods of manufacture4US 9,945,027 B2Fourté International, SDN. BHD · 2018
- Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device3US 8,318,292 B2Sumitomo Bakelite Co., Ltd. · 2012
- Thin metal coating methods for high conductivity graphene and stanene metal composites and methods of manufacture1US 10,544,504 B2Fourté International, SDN. BHD · 2020
- High conductivity graphene-metal composite1US 10,858,733 B2Fourté International, SDN. BHD · 2020