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US 8,318,292 B2Granted
Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
AssigneeSumitomo Bakelite Co., Ltd.
InventorNoriyuki Ohigashi
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Abstract
A resin sheet with a copper foil, comprising: a carrier layer; a copper foil layer having a thickness 0.5 to 5 μm provided over the carrier layer; and an insulating resin layer formed over the copper foil layer, wherein the insulating resin layer is once abutted with base material, and then the carrier layer is delaminated from the copper foil layer, and wherein the insulating resin layer contains a cyanate ester resin having phenolic novolac backbone and a polyfunctional epoxy resin.
Claims15
A resin sheet with a copper foil, comprising:
- a carrier layer;
- a copper foil layer having a thickness 0.5 to 5 μm provided over said carrier layer;
- and
- an insulating resin layer formed over said copper foil layer,
- wherein upon abutting said insulating resin layer to a base material, said carrier layer is delaminated from said copper foil layer, and
- wherein said insulating resin layer contains a cyanate ester resin having phenolic novolac backbone and a polyfunctional epoxy resin.
3 more elements
Dependencies are inferred from the claim text.