B29L 2031/3481
Housings or casings incorporating or embedding electric or electronic elements
Official title: {Housings or casings incorporating or embedding electric or electronic elements}
B29L2031/3481 (Housings or casings incorporating or embedding electric or electronic elements) appears on 613 US grants and 864 published applications in this corpus.
Search patents in B29L- Granted patents
- 613
- Published applications
- 864
- Assignees
- 439
- Inventors
- 1,906
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 4 | 3 |
| 2003 | 2 | 2 |
| 2004 | 1 | 5 |
| 2005 | 3 | 9 |
| 2006 | 2 | 3 |
| 2007 | 2 | 5 |
| 2008 | 3 | 3 |
| 2009 | 0 | 9 |
| 2010 | 4 | 19 |
| 2011 | 5 | 27 |
| 2012 | 6 | 24 |
| 2013 | 14 | 43 |
| 2014 | 21 | 62 |
| 2015 | 24 | 67 |
| 2016 | 40 | 108 |
| 2017 | 66 | 60 |
| 2018 | 78 | 75 |
| 2019 | 69 | 61 |
| 2020 | 61 | 69 |
| 2021 | 41 | 38 |
| 2022 | 39 | 48 |
| 2023 | 34 | 39 |
| 2024 | 37 | 37 |
| 2025 | 26 | 34 |
| 2026 | 11 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Buckle assembly, pressing and cutting jig, and method and apparatus for manufacturing package structure29 Sep 2026US 12,746,728 B2Boe Technology Group Co., Ltd.
- Continuous-fiber-reinforced resin molding and method for manufacturing same15 Sep 2026US 12,734,765 B2Asahi Kasei Kabushiki Kaisha
- Housing and method for manufacturing the same1 Sep 2026US 12,722,333 B2Lite-On Technology Corporation
- Method for producing a multilayer body and a multilayer body2 Jun 2026US 12,643,278 B2Burg Design GmbH
- Metalized plastic housing enclosure heat sink2 Jun 2026US 12,644,958 B2Aptiv Technologies AG
- Engineering plastics incorporating carbon fibers and carbon nanotubes for tuned performance characteristics10 Sep 2026US 2026/0265494 A1
- Housing device and method27 Aug 2026US 2026/0254018 A1Siemens Energy, Inc.
- Resin molded product and manufacturing method of resin molded product20 Aug 2026US 2026/0241622 A1Jtekt Corporation
- Component for vehicle interior20 Aug 2026US 2026/0241881 A1
- A method of assessing the impact of ultrasonic welding on a part during a pre-production process and an apparatus for the same13 Aug 2026US 2026/0233472 A1Vodafone Automotive S.p.A.
Most cited
By later US patents
- Fully encapsulated electronics and printed circuit boards515US 10,667,408 B2Covidien LP · 2020
- Workpiece of plastic and production process for such a workpiece121US 5,893,959 AMarquardt GmbH · 1999
- Cover for an optical device and method for making same96US 6,428,650 B1Amerasia International Technology, Inc. · 2002
- Filtration chamber construction for a cyclonic surface cleaning apparatus82US 8,590,102 B2G.B.D. Corp. · 2013
- Offset control for assembling an electronic device housing75US 8,551,283 B2Apple Inc. · 2013