B29K 2069/00
Use of pc, i.e. polycarbonates or derivatives thereof, as moulding material
Official title: Use of PC, i.e. polycarbonates {or derivatives thereof}, as moulding material
B29K2069/00 (Use of pc, i.e. polycarbonates or derivatives thereof, as moulding material) appears on 1,255 US grants and 1,676 published applications in this corpus.
Search patents in B29K- Granted patents
- 1,255
- Published applications
- 1,676
- Assignees
- 799
- Inventors
- 3,610
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 6 | 0 |
| 1987 | 5 | 0 |
| 1988 | 9 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 10 | 0 |
| 1992 | 9 | 0 |
| 1993 | 16 | 0 |
| 1994 | 14 | 0 |
| 1995 | 16 | 0 |
| 1996 | 13 | 0 |
| 1997 | 5 | 0 |
| 1998 | 14 | 0 |
| 1999 | 10 | 0 |
| 2000 | 15 | 0 |
| 2001 | 9 | 5 |
| 2002 | 21 | 20 |
| 2003 | 23 | 61 |
| 2004 | 26 | 49 |
| 2005 | 23 | 61 |
| 2006 | 28 | 70 |
| 2007 | 27 | 64 |
| 2008 | 33 | 62 |
| 2009 | 23 | 77 |
| 2010 | 40 | 76 |
| 2011 | 50 | 73 |
| 2012 | 41 | 45 |
| 2013 | 48 | 45 |
| 2014 | 50 | 66 |
| 2015 | 27 | 77 |
| 2016 | 44 | 111 |
| 2017 | 68 | 105 |
| 2018 | 75 | 107 |
| 2019 | 83 | 87 |
| 2020 | 80 | 86 |
| 2021 | 52 | 87 |
| 2022 | 58 | 69 |
| 2023 | 51 | 43 |
| 2024 | 40 | 53 |
| 2025 | 41 | 49 |
| 2026 | 25 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing continuous fiber-reinforced thermoplastic resin sheet22 Sep 2026US 12,741,399 B2Mitsubishi Gas Chemical Company, Inc.
- Translucent multi-layer body with a heat- or pressure-sensitive decorative layer15 Sep 2026US 12,734,735 B2Covestro Deutschland AG
- Curable polymeric compositions18 Aug 2026US 12,709,698 B2Poly-Med, Inc.
- Ultrasonic welding and related techniques for luggage4 Aug 2026US 12,697,782 B2JRSK, Inc.
- Imprint lithography using multi-layer coating architecture21 Jul 2026US 12,687,725 B2Magic Leap, Inc.
- Additive production device and associated additive production method8 Oct 2026US 2026/0307327 A1EOS GmbH Electro Optical Systems
- Dispersion powder and method for producing the same, heat ray shielding resin molded product, and heat ray shielding laminate24 Sep 2026US 2026/0286023 A1Sumitomo Metal Mining Co., Ltd.
- Laminate for thermoforming24 Sep 2026US 2026/0286078 A1Mitsubishi Gas Chemical Company, Inc.
- Imprint lithography using multi-layer coating architecture24 Sep 2026US 2026/0287905 A1Magic Leap, Inc.
- Polymer compound and method for decomposing same, plastic product containing said polymer compound, fiber-reinforced plastic and method for recovering fibers contained therein, and method for producing polyester, polyurethane, or polycarbonate20 Aug 2026US 2026/0242564 A1Kanagawa University
Most cited
By later US patents
- Apparatus and method for photoetching of polyimides, polycarbonates and polyetherimides552US 4,857,382 AGeneral Electric Company · 1989
- Substrate mounting for organic, dielectric, optical film143US 6,951,681 B2Gentex Corporation · 2005
- Housing mechanism for electronic device134US 7,697,269 B2FIH (Hong Kong) Limited · 2010
- Reduced density article119US 10,087,556 B2Sabic Global Technologies B.V. · 2018
- Iron-type golf club head117US 4,664,383 ADaiwa Golf Co., Ltd. · 1987