B29C 65/785
Using magnetic forces to hold at least one of the parts to
Official title: {using magnetic forces to hold at least one of the parts to be joined (magnetic work holders in general B25B11/002)}
B29C65/785 (Using magnetic forces to hold at least one of the parts to) appears on 28 US grants and 24 published applications in this corpus.
Search patents in B29C- Granted patents
- 28
- Published applications
- 24
- Assignees
- 20
- Inventors
- 45
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 2 |
| 2015 | 2 | 2 |
| 2016 | 4 | 3 |
| 2017 | 3 | 2 |
| 2018 | 2 | 1 |
| 2019 | 1 | 1 |
| 2020 | 3 | 4 |
| 2021 | 3 | 4 |
| 2022 | 2 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 0 |
| 2025 | 1 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Device and method for joining together two joining partners7 Apr 2026US 12,594,731 B2Continental Autonomous Mobility Germany GmbH
- Laminating device15 Jul 2025US 12,358,268 B2Panasonic Holdings Corporation
- Transfer tool and method for transferring semiconductor chips25 Jun 2024US 12,020,973 B2OSRAM Opto Semiconductors GmbH
- Connection method for chassis sealing elements18 Jul 2023US 11,701,840 B2Cqlt Saargummi Technologies S.à.R.L.
- Methods and systems for identifying processing locations in composite layups18 Oct 2022US 11,472,138 B2The Boeing Company
- Device and method for joining together two joining partners13 Feb 2025US 2025/0050593 A1Continental Autonomous Mobility Germany GmbH
- Laminating device31 Aug 2023US 2023/0271410 A1Panasonic Corporation
- Transfer Tool and Method for Transferring Semiconductor Chips9 Dec 2021US 2021/0384062 A1OSRAM Opto Semiconductors GmbH
- Methods and systems for identifying processing locations in composite layups9 Sep 2021US 2021/0276287 A1The Boeing Company
- Methods and systems for identifying processing locations in composite layups15 Apr 2021US 2021/0107240 A1The Boeing Company
Most cited
By later US patents
- Staged cocuring of composite structures13US 8,834,668 B2The Boeing Company · 2014
- Automatic joining apparatus for a carcass ply9US 4,793,890 AMitsubishi Jukogyo Kabushiki Kaisha · 1988
- Device for splicing self-adhesive crude rubber sheet material7US 5,228,941 ABridgestone Corporation · 1993
- Method of securing composite core during a manufacturing process6US 9,211,618 B2Bell Helicopter Textron Inc. · 2015
- Platen web splicer apparatus and method6US 9,670,022 B2Tamarack Products, Inc. · 2017