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US 12,020,973 B2Granted
Transfer tool and method for transferring semiconductor chips
AssigneeOSRAM Opto Semiconductors GmbH
InventorAndreas Plöβl
Life of this patent
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Abstract
In an embodiment a transfer tool includes an adhesive stamp having an adhesive surface configured to pick up a semiconductor chip and a device configured to adjust a surface area of the adhesive surface, wherein the adhesive stamp is deformable, wherein the adhesive surface is formed by a part of an outer surface of the adhesive stamp, wherein the surface area of the adhesive surface is adjustable by deformation of the adhesive stamp, and wherein the adhesive surface is free of interruptions.
Claims19
A transfer tool comprising:
- an adhesive stamp having an adhesive surface configured to pick up a semiconductor chip,
- wherein the adhesive stamp is deformable,
- wherein the adhesive stamp comprises an elastic polymer,
- wherein the adhesive surface is formed by a part of an outer surface of the adhesive stamp,
- wherein a surface area of the adhesive surface is adjustable by deformation of the adhesive stamp, and
- wherein the adhesive surface is free of interruptions;
- and
- a device configured to adjust the surface area of the adhesive surface,
- wherein the transfer tool is configured to transfer the semiconductor chip.
6 more elements
A transfer tool comprising:
- an adhesive stamp having an adhesive surface configured to pick up a semiconductor chip;
- and
- a device configured to adjust a surface area of the adhesive surface,
- wherein the adhesive stamp is deformable,
- wherein the adhesive surface is formed by a part of an outer surface of the adhesive stamp,
- wherein the surface area of the adhesive surface is adjustable by deformation of the adhesive stamp,
- wherein the adhesive surface is free of interruptions,
- wherein the adhesive stamp has a deformation portion laterally adjacent to a volume portion,
- wherein the volume portion comprises a photoisomerizable material, and/or wherein the device is configured to guide electromagnetic radiation to the volume portion, and
- wherein the transfer tool is configured to transfer the semiconductor chip.
7 more elements
A transfer tool comprising:
- an adhesive stamp having an adhesive surface configured to pick up a semiconductor chip,
- wherein the adhesive stamp is deformable,
- wherein the adhesive surface is formed by a part of an outer surface of the adhesive stamp,
- wherein the surface area of the adhesive surface is adjustable by deformation of the adhesive stamp, and
- wherein the adhesive surface is free of interruptions,
- a device configured to adjust a surface area of the adhesive surface,
- wherein the transfer tool is configured to transfer the semiconductor chip, and
- wherein the adhesive stamp has an opening, the device being configured to adjust a volume of the opening, or
- wherein the adhesive stamp comprises a deformable volume portion, the adhesive surface is a part of an outer surface of the volume portion, the adhesive stamp has a deformation portion laterally adjacent to the volume portion, and wherein the device is configured to exert a force on the adhesive stamp in the deformation portion, which is directed transversely or perpendicularly to a main extension plane of the adhesive stamp, the force being a magnetic or an electrostatic force, or
- wherein a metal layer is located on the outer surface of the adhesive stamp.
7 more elements
Dependencies are inferred from the claim text.