B29C 65/7415
Characterised by the pressure relationship between the joining step and the severing
Official title: {characterised by the pressure relationship between the joining step and the severing step}
B29C65/7415 (Characterised by the pressure relationship between the joining step and the severing) appears on 5 US grants and 3 published applications in this corpus.
Search patents in B29C- Granted patents
- 5
- Published applications
- 3
- Assignees
- 3
- Inventors
- 10
- Latest grant
- 1 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Method of bonding substrates, microchip and method of manufacturing the same1 Oct 2024US 12,103,246 B2Ushio Denki Kabushiki Kaisha
- Method and device for making tubular bags of thin plastic films by means of an ultrasound welding process15 Aug 2017US 9,731,484 B2Pantec AG
- Heat seal die assembly7 Apr 2009US 7,513,286 B2
- Method of making dresses for dolls and the like and product obtained by this method12 Jul 1983US 4,392,257 A
- Process for the manufacture of locks of hair from synthetic fibers, device for putting this process into operation and locks of hair thus obtained22 Mar 1983US 4,377,427 AR. George S.A.
- Method of bonding substrates, microchip and method of manufacturing the same24 May 2018US 2018/0141280 A1Ushio Denki Kabushiki Kaisha
- Method and device for making tubular bags of thin plastic films by means of an ultrasound welding process1 Jan 2015US 2015/0000821 A1Pantec AG
- Heat seal die assembly15 Dec 2005US 2005/0274262 A1
Most cited
By later US patents
- Method of making dresses for dolls and the like and product obtained by this method9US 4,392,257 A1983
- Process for the manufacture of locks of hair from synthetic fibers, device for putting this process into operation and locks of hair thus obtained8US 4,377,427 AR. George S.A. · 1983
- Heat seal die assembly1US 7,513,286 B22009