B29C 45/14836
Preventing damage of inserts during injection
Official title: {Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage (B29C45/14434 takes precedence)}
B29C45/14836 (Preventing damage of inserts during injection) appears on 250 US grants and 307 published applications in this corpus.
Search patents in B29C- Granted patents
- 250
- Published applications
- 307
- Assignees
- 253
- Inventors
- 741
- Latest grant
- 9 Jun 2026
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| Year | Granted patents | Published applications |
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| 2024 | 9 | 10 |
| 2025 | 3 | 2 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Production method of a conductive member9 Jun 2026US 12,651,682 B2Nagase & Co., Ltd.
- Overmold bracket with open mounting surface on bracket13 Jan 2026US 12,522,058 B2Magna Exteriors Inc.
- Method of manufacturing an animal tag, as well as animal tag12 Aug 2025US 12,387,079 B2Nedap N.V.
- Molding device with self-blocking feed channel1 Jul 2025US 12,347,701 B2Robert Bosch GmbH
- Support plate and portable communication device including the same22 Apr 2025US 12,283,978 B2Samsung Electronics Co., Ltd.
- Process for producing a plastics component9 Jul 2026US 2026/0192530 A1BASF SE
- Multi-material hybrid forming method and process based on single mold opening and closing, and multi-material component30 Apr 2026US 2026/0116035 A1Intelligent Aerospace Manufacturing Technology (Beijing) Co., Ltd.
- Method for Connecting Extruded Flexible Components to Molded Parts5 Mar 2026US 2026/0061676 A1Gram Medical Inc.
- Multi-material hybrid forming device based on single mold opening and closing9 Oct 2025US 2025/0312837 A1Intelligent Aerospace Manufacturing Technology (Beijing) Co., Ltd.
- Method of making compression molded parts with back injection molded features31 Jul 2025US 2025/0242529 A1Gemini Group, Inc.
Most cited
By later US patents
- Fully encapsulated electronics and printed circuit boards515US 10,667,408 B2Covidien LP · 2020
- Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof178US 5,777,391 AHitachi, Ltd. · 1998
- Overmolded transponder71US 6,778,089 B2Avid Identification Systems, Inc. · 2004
- Overmolded transponder58US 6,441,741 B1Avid Identification Systems, Inc. · 2002
- Laminated functional wafer for plastic optical elements53US 7,036,932 B2Vision-Ease Lens, Inc. · 2006