B29C 2945/76806
Post-treatment devices
Official title: post-treatment devices
B29C2945/76806 (Post-treatment devices) appears on 4 US grants and 6 published applications in this corpus.
Search patents in B29C- Granted patents
- 4
- Published applications
- 6
- Assignees
- 4
- Inventors
- 7
- Latest grant
- 12 Nov 2024
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| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 1 |
| 2023 | 1 | 0 |
| 2024 | 1 | 0 |
| 2025 | 0 | 1 |
By publication year.
Recent patents
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- Injection molding apparatus, cooling plate for injection molding apparatus, and cassette mold19 Dec 2023US 11,845,212 B2Seiko Epson Corporation
- Method and apparatus for post-mold cooling a molded article15 Oct 2013US 8,557,156 B2Husky Injection Molding Systems Ltd.
- Method and apparatus for controlling cooling rates during post-mold cooling of a molded article2 Sep 2008US 7,421,310 B2Husky Injection Molding Systems Ltd.
- Integrated injection-molding method for lens, and lens formed by integrated injection-molding method13 Nov 2025US 2025/0346006 A1Shenzhen Linktop IOT Co., Ltd
- Injection Molding Machine Management System12 May 2022US 2022/0143887 A1Seiko Epson Corporation
- Injection molding apparatus, cooling plate for injection molding apparatus, and cassette mold29 Jul 2021US 2021/0229333 A1Seiko Epson Corporation
- Method and apparatus for post-mold cooling a molded article17 May 2012US 2012/0119413 A1Husky Injection Molding Systems Ltd.
- Method and apparatus for post-mold cooling a molded article13 Aug 2009US 2009/0200698 A1Husky Injection Molding Systems Ltd.
Most cited
By later US patents