Injection molding apparatus, cooling plate for injection molding apparatus, and cassette mold
AssigneeSeiko Epson Corporation
InventorKakeru SASAGAWA
Life of this patent
Estimating the term…
Loading patent…
AssigneeSeiko Epson Corporation
InventorKakeru SASAGAWA
Estimating the term…
An injection molding apparatus includes: a molding mold including a fixed mold in which a gate into which a molding material flows is formed, and a movable mold in which a cavity portion is formed and which is separated from the fixed mold when the mold is opened; a nozzle in which a flow path that guides the molding material to the gate is formed; and a first cooling plate which is detachably attached to an opposite-side surface of the movable mold from a surface to be in contact with the fixed mold and which is provided with a first cooling mechanism therein, and the first cooling mechanism cools the molding material in the cavity portion.
An injection molding apparatus, comprising:
A cooling plate for injection molding apparatus, the injection molding apparatus including:
A cassette mold for injection molding apparatus, comprising:
Dependencies are inferred from the claim text.