B29C 2945/76765
Moulding material
B29C2945/76765 (Moulding material) appears on 75 US grants and 78 published applications in this corpus.
Search patents in B29C- Granted patents
- 75
- Published applications
- 78
- Assignees
- 58
- Inventors
- 170
- Latest grant
- 3 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 7 | 1 |
| 2002 | 6 | 3 |
| 2003 | 3 | 8 |
| 2004 | 4 | 2 |
| 2005 | 5 | 4 |
| 2006 | 2 | 2 |
| 2007 | 3 | 2 |
| 2008 | 2 | 5 |
| 2009 | 3 | 5 |
| 2010 | 3 | 1 |
| 2011 | 2 | 3 |
| 2012 | 0 | 3 |
| 2013 | 1 | 1 |
| 2014 | 1 | 2 |
| 2015 | 0 | 1 |
| 2016 | 2 | 4 |
| 2017 | 4 | 4 |
| 2018 | 0 | 2 |
| 2019 | 5 | 4 |
| 2020 | 0 | 4 |
| 2021 | 5 | 4 |
| 2022 | 1 | 5 |
| 2023 | 5 | 3 |
| 2024 | 3 | 1 |
| 2025 | 1 | 3 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor die carrier structure3 Jun 2025US 12,322,623 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electric actuator drive for injection molding flow control24 Dec 2024US 12,172,354 B2Synventive Molding Solutions, Inc.
- Method for simultaneous closed loop control of gas assist and gas counter pressure in an injection molding process relative to plastic melt pressure and plastic melt flow position24 Sep 2024US 12,097,648 B2Imflux Inc.
- Semiconductor die carrier structure23 Jan 2024US 11,881,421 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Injection molding adaptive compensation method based on melt viscosity fluctuation3 Oct 2023US 11,772,313 B2Haitian Plastics Machinery Group
- Molding optimization method and device for injection molding machine10 Sep 2026US 2026/0264301 A1Nissei Plastic Industrial Co., Ltd.
- Semiconductor die carrier structure11 Sep 2025US 2025/0285897 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Molding optimization method and device for injection molding machine31 Jul 2025US 2025/0242530 A1Nissei Plastic Industrial Co., Ltd.
- Method and System for Injection Molding26 Jun 2025US 2025/0205947 A1INGLASS S.p.A.
- Semiconductor die carrier structure14 Mar 2024US 2024/0087932 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Manifold system having flow control87US 6,464,909 B1Synventive Molding Solutions, Inc. · 2002
- Apparatus for proportionally controlling fluid delivery to a mold71US 6,309,208 B1Synventive Molding Solutions, Inc. · 2001
- Manifold system having flow control using extended valve pin54US 6,254,377 B1Synventive Molding Solutions, Inc. · 2001
- Apparatus for proportionally controlling fluid delivery to a mold53US 6,287,107 B1Synventive Molding Solutions, Inc. · 2001
- Injection molding system with sequential gate control40US 5,919,492 A1999