B29C 2045/4094
Ejectors located on the fixed mould half
Official title: {Ejectors located on the fixed mould half}
B29C2045/4094 (Ejectors located on the fixed mould half) appears on 10 US grants and 7 published applications in this corpus.
Search patents in B29C- Granted patents
- 10
- Published applications
- 7
- Assignees
- 10
- Inventors
- 17
- Latest grant
- 22 Dec 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 2 | 1 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 3 |
| 2019 | 0 | 0 |
| 2020 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Molding die projection mechanism and molding die comprising same projection mechanism22 Dec 2020US 10,870,228 B2Technocrats Corporation
- Injection molding apparatus and method of use24 Nov 2020US 10,843,393 B2Universal Smart Inc.
- Injection molding machine6 Jan 2015US 8,926,315 B2Sumitomo Heavy Industries, Ltd.
- Injection molding apparatus4 Nov 2014US 8,876,523 B2SK Innovation Co., Ltd.
- Ejection mechanism and mold using the same7 Jan 2014US 8,622,733 B2Hon Hai Precision Industry Co., Ltd.
- Injection Molding Apparatus and Method of Use9 Jan 2020US 2020/0009775 A1Smart Nanos, LLC
- Injection Molding Apparatus and Method of Use31 May 2018US 2018/0147762 A1Universal Smart Inc.
- Molding die projection mechanism and molding die comprising same projection mechanism31 May 2018US 2018/0147763 A1Technocrats Corporation
- Part ejection system for injection molding apparatus8 Mar 2018US 2018/0065287 A1Sabic Global Technologies B.V.
- Injection molding apparatus28 Aug 2014US 2014/0242211 A1SK Innovation Co., Ltd.
Most cited
By later US patents
- Apparatus of multiplunger type for enclosing semiconductor elements with resin34US 4,793,785 A1988
- Molding ejector plate structure and method of ejecting molded articles from mold cavity therewith16US 6,638,467 B1Green Tokai Co., Ltd. · 2003
- Plastic molding apparatus9US 5,429,492 A1995
- Injection molding machine5US 6,056,535 ANissei Plastic Industrial Co., Ltd. · 2000
- Sealing ejector pin5US 6,179,599 B2Fico B.V. · 2001