Sealing ejector pin
AssigneeFico B.V.
InventorsJohannes Lambertus Gerardus Maria Venrooij, Marcel Gerardus Antonius Tomassen
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Abstract
The invention relates to an ejector pin receivable in a mold part of a mold for encapsulating electronic components mounted on a carrier, wherein the substantially cylindrical ejector pin is provided with a side wall in which at least one recess is arranged close to the end which makes contact with the product for ejecting. The invention also relates to a mold part in which an opening is arranged for guiding an ejector pin, wherein at least one recess is arranged in the wall of the opening. The invention further includes a mold for encapsulating electronic components, in addition to a method for sealing an interspace between an ejector pin and an opening in a mold part.
Claims5
A mould part of a mould for encapsulating electronic components mounted on a carrier comprising:
- a mould part having a wall forming at least one cylindrical opening for guiding an ejector pin and at least one recess arranged in the wall of the opening;
- a cylindrical ejector pin having a side wall and at least one ejector pin recess arranged close to an end of the ejector pin which makes contact with a product for ejecting;
- and
- a self-regulating seal formed in the recess arranged in the wall of the opening by encapsulating material which has been received therein,
- wherein the ejector pin moves relative to the self-regulating seal.
Dependencies are inferred from the claim text.