B26D 2001/008
In the form of wires
Official title: {in the form of wires}
B26D2001/008 (In the form of wires) appears on 17 US grants and 32 published applications in this corpus.
Search patents in B26D- Granted patents
- 17
- Published applications
- 32
- Assignees
- 21
- Inventors
- 66
- Latest grant
- 15 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2009 | 0 | 2 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 2 | 5 |
| 2015 | 2 | 1 |
| 2016 | 1 | 1 |
| 2017 | 0 | 3 |
| 2018 | 2 | 2 |
| 2019 | 2 | 3 |
| 2020 | 1 | 2 |
| 2021 | 0 | 0 |
| 2022 | 2 | 2 |
| 2023 | 0 | 3 |
| 2024 | 1 | 0 |
| 2025 | 4 | 4 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Solar panel disassembling apparatus21 Jan 2025US 12,202,240 B2Won Kwang S&T Co., Ltd.
- Solar panel cutting unit27 Aug 2024US 12,070,869 B2Won Kwang S&T Co., Ltd.
- Apparatus for notching an electrode plate16 Apr 2026US 2026/0102938 A1Samsung SDI.Co., Ltd.
- Diamond wire cutting machine20 Nov 2025US 2025/0353206 A1Hi-Tech Wires Asia Co., Ltd
- Food slicer18 Sep 2025US 2025/0289156 A1
- Cutting apparatus using multi-wire and control method thereof10 Jul 2025US 2025/0222613 A1Hanwha Precision Machinery Co., Ltd.
- Solar panel disassembling apparatus17 Apr 2025US 2025/0121593 A1Won Kwang S&T Co., Ltd.
Most cited
By later US patents
- Apparatus, system and method for using a diamond-impregnated wire to cut an object12US 8,651,098 B2Mactech, Inc. · 2014
- System and method for automated backing film removal8US 9,517,615 B2The Boeing Company · 2016
- Wire handling for vehicle glazing panel cut out7US 9,095,988 B2Belron Hungary Kft - Zug Branch · 2015
- Method of forming topping sheet and apparatus thereof2US 10,065,341 B2Toyo Tire & Rubber Co., Ltd. · 2018
- Method of forming topping sheet and apparatus thereof2US 9,944,034 B2Toyo Tire & Rubber Co., Ltd. · 2018