System and method for automated backing film removal

A backing film removal system comprising:

• a substrate support member configured to support a substrate, where a backing film is attached to the substrate;
• a backing film separating member arranged operatively with respect to the substrate support member such that at least a portion of the backing film separating member is positionable between at least one portion of the substrate and backing film when the substrate is disposed on the substrate support member;
• a backing film holding member configured to maintain a separation between the substrate and backing film at the at least one portion of the substrate and backing film;
• at least one drive unit connected to one or more of the substrate support member and the backing film separating member and operable to cause relative movement between the substrate support member and the backing film separating member;
• and
• a transport device to which the backing film separating member is mounted, the transport device being configured to move the hacking film separating member along a predetermined path between the backing film and substrate to effect separation of the backing film from the substrate;
• wherein the backing film separating member is rotatably coupled to the transport device where the transport device drives the hacking film separating member both rotationally and linearly relative to the substrate support member.