B23K 26/324
Involving non-metallic parts
Official title: involving non-metallic parts
B23K26/324 (Involving non-metallic parts) appears on 200 US grants and 300 published applications in this corpus.
Search patents in B23K- Granted patents
- 200
- Published applications
- 300
- Assignees
- 211
- Inventors
- 610
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 1 |
| 2003 | 2 | 2 |
| 2004 | 1 | 1 |
| 2005 | 2 | 2 |
| 2006 | 1 | 3 |
| 2007 | 0 | 2 |
| 2008 | 0 | 1 |
| 2009 | 2 | 7 |
| 2010 | 1 | 7 |
| 2011 | 1 | 8 |
| 2012 | 4 | 17 |
| 2013 | 5 | 10 |
| 2014 | 7 | 8 |
| 2015 | 18 | 12 |
| 2016 | 12 | 15 |
| 2017 | 6 | 16 |
| 2018 | 6 | 13 |
| 2019 | 15 | 18 |
| 2020 | 15 | 15 |
| 2021 | 11 | 33 |
| 2022 | 13 | 18 |
| 2023 | 11 | 24 |
| 2024 | 13 | 31 |
| 2025 | 33 | 15 |
| 2026 | 9 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Device and a method of manufacturing a device, such as a liquid lens, with bond configured to fracture at the same burst pressure15 Sep 2026US 12,736,717 B2Corning Incorporated
- Laser control structure and laser bonding method using the same25 Aug 2026US 12,715,070 B2Electronics and Telecommunications Research Institute
- Method of making vacuum insulated panel25 Aug 2026US 12,715,199 B2LuxWall, Inc.
- Bonded body manufacturing method and bonded body12 May 2026US 12,623,962 B2Nippon Electric Glass Co., Ltd.
- Hermetically sealed glass package7 Apr 2026US 12,595,169 B2Schott AG
- Laser welding of optical fibers to substrates17 Sep 2026US 2026/0273662 A1Corning Research & Development Corporation
- Device and a method of manufacturing a device, such as a liquid lens, with bonds configured to fracture at the same burst pressure10 Sep 2026US 2026/0267038 A1Corning Incorporated
- Laser-assisted in-situ forming process using high-temperature inert gas shielding and apparatus thereof27 Aug 2026US 2026/0249396 A1Donghua University
- Method of heating an optical element23 Jul 2026US 2026/0208457 A1Essilor International
- Miniature Implantable Device enclosure having an optically transparent window bound to a metal housing with a micro-scale diffusion bond18 Jun 2026US 2026/0166653 A1Greatbatch Ltd.
Most cited
By later US patents
- Method of cutting material for use in implantable medical device401US 6,872,226 B23F Therapeutics, Inc. · 2005
- Method for selective laser sintering with layerwise cross-scanning368US 5,155,324 A1992
- Precision spray processes for direct write electronic components212US 6,251,488 B1Optomec Design Company · 2001
- Continuous calibration of a non-contact thermal sensor for laser sintering116US 6,930,278 B13D Systems, Inc. · 2005
- Laser joining of thermoplastic and thermosetting materials112US 4,414,166 AInternational Business Machines Corporation · 1983