B22F 3/045
Semi-isostatic pressure
Official title: {Semi-isostatic pressure}
B22F3/045 (Semi-isostatic pressure) appears on 6 US grants and 5 published applications in this corpus.
Search patents in B22F- Granted patents
- 6
- Published applications
- 5
- Assignees
- 9
- Inventors
- 24
- Latest grant
- 11 Jun 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 1 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Hardmetals and method for producing the same11 Jun 2024US 12,006,559 B2Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Powder press19 Dec 2006US 7,150,851 B2SMS Meer GmbH
- Semiconductor package and method for producing heat-radiating substrate for it9 Aug 2005US 6,926,861 B2Tokyo Tungsten Co., Ltd.
- Semiconductor package and method for producing heat-radiating substrate for it17 Feb 2004US 6,693,353 B1Tokyo Tungsten Co., Ltd.
- Apparatus for producing molded articles from a pourable compound13 May 1986US 4,588,368 AHutschenreuther AG
- Hard metals and method for producing the same16 Feb 2023US 2023/0052721 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Tungsten cathode material16 Jan 2014US 2014/0017114 A1Nippon Tungsten Co., Ltd.
- Long carbonaceous molding, long carbonaceous product, and method of production thereof10 Apr 2008US 2008/0084003 A1Toyo Tanso Co., Ltd.
- Powder press8 Dec 2005US 2005/0269729 A1SMS Meer GmbH
- Semiconductor package and method for producing heat-radiating substrate for it25 Mar 2004US 2004/0056352 A1Tokyo Tungsten Co., Ltd.
Most cited
By later US patents
- Method of manufacturing dry-pressed molded articles43US 4,473,526 AEugen Buhler · 1984
- Apparatus for producing molded articles from a pourable compound11US 4,588,368 AHutschenreuther AG · 1986
- Semiconductor package and method for producing heat-radiating substrate for it5US 6,693,353 B1Tokyo Tungsten Co., Ltd. · 2004
- Semiconductor package and method for producing heat-radiating substrate for it4US 6,926,861 B2Tokyo Tungsten Co., Ltd. · 2005