B22F 1/0551
Flake form nanoparticles
Official title: {Flake form nanoparticles}
B22F1/0551 (Flake form nanoparticles) appears on 86 US grants and 131 published applications in this corpus.
Search patents in B22F- Granted patents
- 86
- Published applications
- 131
- Assignees
- 81
- Inventors
- 296
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 2 |
| 2006 | 1 | 4 |
| 2007 | 2 | 5 |
| 2008 | 0 | 6 |
| 2009 | 2 | 7 |
| 2010 | 2 | 10 |
| 2011 | 2 | 1 |
| 2012 | 5 | 8 |
| 2013 | 4 | 6 |
| 2014 | 6 | 3 |
| 2015 | 8 | 7 |
| 2016 | 4 | 8 |
| 2017 | 6 | 10 |
| 2018 | 5 | 8 |
| 2019 | 6 | 6 |
| 2020 | 6 | 8 |
| 2021 | 8 | 5 |
| 2022 | 2 | 5 |
| 2023 | 4 | 7 |
| 2024 | 3 | 6 |
| 2025 | 3 | 5 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Copper particles and method for manufacturing same22 Sep 2026US 12,741,312 B2Mitsui Kinzoku Company, Limited
- Sintering paste and use thereof for connecting components3 Feb 2026US 12,539,566 B2Heraeus Deutschland GmbH & Co. KG
- Methods for treating metal nanocrystals and for forming bulk nanostructured metal alloys13 Jan 2026US 12,522,928 B2Northwestern University
- Compositions, comprising silver nanoplatelets6 Jan 2026US 12,515,253 B2BASF SE
- Security element13 May 2025US 12,296,391 B2BASF SE
- Compositions, comprising silver nanoplatelets8 Oct 2026US 2026/0307149 A1BASF SE
- Two-dimensional metal nanosheet, preparation method thereof and thermal interface material19 Mar 2026US 2026/0077405 A1Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences
- Method for manufacturing conductive via-containing substrate, conductive via-containing substrate, and metal paste25 Dec 2025US 2025/0387833 A1
- Platelet nanoparticles, compositions thereof, and formation thereof4 Dec 2025US 2025/0367728 A1Kuprion Inc.
- Oxide-containing plate-shaped copper particle, paste composition, semiconductor device, electrical component and electronic component3 Jul 2025US 2025/0214180 A1KYOCERA Corporation
Most cited
By later US patents
- High-throughput printing of semiconductor precursor layer from inter-metallic microflake particles28US 8,329,501 B1Nanosolar, Inc. · 2012
- Silver nanoplate compositions and methods20US 9,249,334 B2nanoComposix, Inc. · 2016
- Silver nanoplate compositions and methods18US 9,212,294 B2nanoComposix, Inc. · 2015
- High-throughput printing of semiconductor precursor layer from nanoflake particles15US 7,700,464 B2Nanosolar, Inc. · 2010
- Flaky magnetic metal particles, pressed powder material, rotating electric machine, motor, and generator14US 10,071,421 B2Kabushiki Kaisha Toshiba · 2018