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US 12,539,566 B2Granted
Sintering paste and use thereof for connecting components
AssigneeHeraeus Deutschland GmbH & Co. KG
InventorsLy May Chew, Wolfgang Schmitt, Michael Schäfer
Life of this patent
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Abstract
The invention relates to a sintering paste consisting of: (A) 30 to 40 wt. % of silver flakes with an average particle size ranging from 1 to 20 μm, (B) 8 to 20 wt. % of silver particles with an average particle size ranging from 20 to 100 nm, (C) 30 to 45 wt. % of silver(I) oxide particles, (D) 12 to 20 wt. % of at least one organic solvent, (E) 0 to 1 wt. % of at least one polymer binder, and (F) 0 to 0.5 wt. % of at least one additive differing from constituents (A) to (E).
Claims19
A sintering paste consisting of:
- (A) 32 to 37 wt. % of silver flakes with an average particle size ranging from 1 to 20 μm;
- (B) 10 to 16 wt. % of silver particles with an average particle size ranging from 20 to 100 nm;
- (C) 32 to 40 wt. % of silver(I) oxide particles;
- (D) 12 to 20 wt. % of at least one organic solvent;
- (E) 0 to 1 wt. % of at least one polymer binder;
- and
- (F) 0 to 0.5 wt. % of at least one additive differing from constituents (A) to (E).
4 more elements
Dependencies are inferred from the claim text.