Unit Process Assemblies, Inc.
Syosset, NY, US· latest recorded location
Unit Process Assemblies, Inc. is named on 7 US grants and 0 published applications in this corpus. Its most frequent classification is G01B (Measuring length, thickness or similar linear dimensions).
- Granted patents
- 7
- Published applications
- 0
- Inventors
- 8
- Granted in 2026 so far
- 0
- Most recent grant
- 21 Oct 1980
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
By publication year.
Technology areas
Share of 7 documents
Recent patents
- Backscatter apparatus and method for measuring thickness of a continuously moving coated strip of substrate material21 Oct 1980US 4,229,652 A
- Backscatter instrument having indexing feature for measuring coating thickness of elements on a continuously moving web of substrate material26 Feb 1980US 4,190,770 A
- Thickness measurement instrument with memory storage of multiple calibrations15 May 1979US 4,155,009 A
- Backscatter instrument for measuring thickness of a continuously moving coated strip of substrate material19 Sep 1978US 4,115,690 A
- Card controlled beta backscatter thickness measuring instrument14 Mar 1978US 4,079,237 A
No published applications.
Most cited
By later US patents
- Thickness measurement instrument with memory storage of multiple calibrations29US 4,155,009 A1979
- Card controlled beta backscatter thickness measuring instrument15US 4,079,237 A1978
- Control card receiving and sensing assembly8US 4,046,994 A1977
- Electrode assembly for measuring the effective thickness of thru-hole plating circuit board workpieces7US 4,042,880 A1977
- Backscatter instrument for measuring thickness of a continuously moving coated strip of substrate material4US 4,115,690 A1978