Sinter Limited
Bristol, GB· latest recorded location
Sinter Limited is named on 5 US grants and 0 published applications in this corpus. Its most frequent classification is B23K (Soldering or unsoldering).
- Granted patents
- 5
- Published applications
- 0
- Inventors
- 3
- Granted in 2026 so far
- 0
- Most recent grant
- 6 Oct 1987
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
By publication year.
Technology areas
Share of 5 documents
- B23KSoldering or unsoldering3
- H05KPrinted circuits3
- B29CShaping or joining of plastics2
- B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding2
- C23CCoating metallic material1
- D06BTreating textile materials using liquids, gases or vapours1
- D06CFinishing, dressing, tentering or stretching textile fabrics1
- F26BDrying solid materials or objects by removing liquid therefrom1
- Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests1
Recent patents
- Method and installation for drying a continuous material impregnated with a hardenable synthetic resin6 Oct 1987US 4,697,355 A
- Process for the application of solder on printed circuit boards and process for their placement in and removal from this device4 Sep 1984US 4,469,716 A
- Solder leveling device having means for vertically guiding printed circuit boards15 Nov 1983US 4,414,914 A
- Apparatus for applying solder to printed circuit boards11 Oct 1983US 4,408,560 A
- Method and apparatus for the thermal treatment of impregnated material webs3 Aug 1982US 4,342,718 A
No published applications.
Most cited
By later US patents
- Apparatus for applying solder to printed circuit boards30US 4,408,560 A1983
- Method and apparatus for the thermal treatment of impregnated material webs8US 4,342,718 A1982
- Process for the application of solder on printed circuit boards and process for their placement in and removal from this device8US 4,469,716 A1984
- Solder leveling device having means for vertically guiding printed circuit boards4US 4,414,914 A1983
- Method and installation for drying a continuous material impregnated with a hardenable synthetic resin3US 4,697,355 A1987