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US 4,414,914 AGranted
Solder leveling device having means for vertically guiding printed circuit boards
AssigneeSinter Limited
InventorHans P. Caratsch
Life of this patent
Estimating the term…
Abstract
A printed circuit board solder leveling device comprising guides distributed across the width of the soldering bath container. Each guide comprises opposed guide rods spaced apart a distance greater than the thickness of a printed circuit board so that there is loose contact only of the guides with opposite sides of the board.
Claims14
An apparatus for the application of solder to a printed circuit board, said apparatus comprising:
- a solder bath container adapted to contain therein a solder bath, said container havng an open upper end, whereby a printed circuit board is movable vertically through said open upper end into and out of the solder bath;
- and
- guide means for guiding the printed circuit board during movement thereof into and out of the solder bath by loose contact only with opposite sides of the printed circuit board and without contact with lateral edges thereof, said guide means comprising a plurality of generally vertically extending rod-shaped guide elements extending into the solder bath within said container and arranged in two parallel rows spaced from each other by a distance greater than the thickness of a printed circuit board to be soldered, each said row comprising plural said guide elements spaced from each other across the width of said container and adapted to confront and guide a respective side of the printed circuit board, at least one of said guide elements being mounted in such a manner so as not to impede contact of said solder both with said lateral edges of a printed circit board.
Dependencies are inferred from the claim text.