Module Design, Inc.
Pittsburgh, PA, US· latest recorded location
Module Design, Inc. is named on 1 US grants and 1 published applications in this corpus. Its most frequent classification is B32B (Layered products, i.e. products built-up of strata of flat or non-flat).
- Granted patents
- 1
- Published applications
- 1
- Inventors
- 2
- Granted in 2026 so far
- 0
- Most recent grant
- 17 Mar 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2020 | 1 | 1 |
By publication year.
Technology areas
Share of 2 documents
Recent patents
Most cited
By later US patents